What is the Global 450 Consortium (G450C) Program?

The G450C is focused on building the 450mm wafer and equipment development environment. The consortium, made up of 5 member companies (Intel, TSMC, GLOBALFOUNDRIES, IBM, Samsung) and New York State partnering with the The Colleges of Nanoscale Science and Engineering (CNSE) at SUNY Polytechnic Institute (SUNY Poly) is:

• a New York based consortium.
• built on the base program started under ISMI’s R450 Program.
• funded to collaboratively work with suppliers to develop 450mm equipment.
• using wafers, equipment, people and cleanroom space to develop and test equipment to meet industry needs.

Vision

The vision of the G450C is to be a public-private partnership program (New York State (SUNY Poly), Intel, TSMC, Samsung, IBM and GLOBALFOUNDRIES) that develops cost-effective test wafer fabrication infrastructure, equipment prototypes and high-volume tools to enable a coordinated industry transition to 450mm wafers. The program will use the capabilities established at SUNY Poly for joint development activities and support of a comprehensive industry ecosystem.

Objectives

The objectives of the G450C are:

• to assure a smooth and coordinated 450mm wafer transition;
• expand test wafer operations to accelerate and support supplier development;
• support tool demonstrations;
• demonstrate a full 450mm fab tool set;
• continued 450mm research and development after the completion of equipment demonstrations;
• enable innovation, but not slow scaling;
• enable OEMs and tool makers to transition to 450mm in a highly coordinated fashion under a financially (New York) leveraged business strategy; and
• work with suppliers and other associations/consortia to develop standards and support the development of common equipment building blocks.